Zeziphi iiPropati zeFr4 Substrate?

I-FR4 sheet substrate yinxalenye ebalulekileyo kushishino lwe-elektroniki, isetyenziswa kakhulu ngenxa yeempawu zayo ezibalaseleyo kunye nokuguquguquka kwayo. Njengomvelisi ophambili wee-insulating sheets onamava angaphezu kwamashumi amabini eminyaka, thina kwi-J&Q sinolwazi olunzulu malunga neempawu ze-FR4 substrate kunye nokusetyenziswa kwayo. Kule sikhokelo sibanzi, siza kuhlola iimpawu eziphambili ezenza i-FR4 sheet substrate ibe yinto engabalulekanga kwii-elektroniki zanamhlanje.

	Ulwazi olusisiseko:Iphepha leFR4 Igama Brand: JingHong Izinto eziphathekayo: I-Epoxy Resin Umbala Wendalo: Okuluhlaza Okukhanyayo Ukutyeba: 0.3mm --- 100mm Ubungakanani obuqhelekileyo: 1030mm * 1230mm Ubungakanani obuqhelekileyo: 1030mm * 2030mm, 1220mm * 2440mm, 1030mm * 1030mm 1030mm * 2070mm Ukupakishwa: Ukupakisha rhoqo, Khusela ngePallet
Qhagamshelana nathi

Iipropati zoMbane ze-FR4 Substrate

Amandla eDielectric kunye ne-Insulation

I-FR4 sheet substrate idume ngamandla ayo edielectric achukumisayo, ukusuka kwi-20 ukuya kwi-80 kV/mm, ebonelela ngokugqunywa kombane okukhethekileyo. La mandla aphezulu e-dielectric anceda ukukhusela ukuvuza kwangoku, ukuqinisekisa ukusebenza okuthembekileyo kweesekethe zombane. Ukongezelela, i-FR4 ye-dielectric ephantsi rhoqo, ngokuqhelekileyo phakathi kwe-4.0 kunye ne-4.5 kwi-1 MHz, idlala indima ephambili kwizicelo ze-high-frequency, ukunciphisa ilahleko yesignali, ukunciphisa i-crosstalk, kunye nokugcina ukusebenza ngokubanzi koyilo lwesekethe enzima.

IFactor yokuLahlwa okuPhantsi

Enye ipropathi engundoqo yombane ye-FR4 sheet substrate yinto ephantsi yokuchitha, ngokuqhelekileyo malunga ne-0.02 kwi-1 MHz. Olu phawu lunciphisa kakhulu ukulahleka kwamandla njengobushushu, ukuphucula ukusebenza kakuhle kwezixhobo zombane. Umba wokulahla ophantsi uluncedo ngakumbi kwiisekethe zedijithali ezinesantya esiphezulu kunye nosetyenziso lwamaza kanomathotholo (RF), apho ukugcina imfezeko yomqondiso kunye nokunciphisa ilahleko yamandla kubaluleke kakhulu ekusebenzeni kakuhle kwiinkqubo zombane eziphucukileyo.

Umthamo kunye noKuxhathisa uMphezulu

I-FR4 sheet substrate iyaziwa ngomthamo wayo ophezulu kunye nokumelana nomphezulu, okuyizinto eziphambili kwiimpawu zayo ezibalaseleyo zokukhusela. Ngomthamo wokumelana nomthamo odla ngokudlula i-10 ^ 9 ohm-cm kunye nokumelana nomgangatho ofikelela ngaphezu kwe-10 ^ 6 ohms, iphepha le-FR4 lithintela ngokufanelekileyo ukuvuza kwangoku ngokusebenzisa izinto. Ezi zakhiwo zinceda ukuqinisekisa ukuthembeka kunye nexesha elide lamacandelo e-elektroniki, ukubonelela ngokusebenza okuzinzile kuluhlu olubanzi lwezicelo apho ukuhlukaniswa kombane kubalulekile ekusebenzeni ngokufanelekileyo.

IiPropati zoomatshini be-FR4 Substrate

Amandla e-Tensile kunye ne-Flexural Modulus

I-FR4 sheet substrate ibonisa amandla amangalisayo oomatshini, kunye namandla okutsalwa aqhele ukuba phakathi kwama-250 ukuya kuma-550 MPa. Olu kuqina lwenza ukuba izinto zikwazi ukunyamezela uxinzelelo loomatshini ngexesha lokwenziwa kunye nokusebenza ngexesha lokusebenza. Ukongeza, i-flexural modulus ye-FR4, edla ngokuba phakathi kwe-17 kunye ne-24 GPa, iqinisekisa ukuqina okufunekayo ukugcina ukuthembeka kwesakhiwo. Ezi mpawu zoomatshini zenza i-FR4 ilungele ukusetyenziswa kwiindawo zokudibanisa ze-elektroniki ezintsonkothileyo, apho amandla kunye nozinzo kubalulekile ekusebenzeni ixesha elide.

Uzinzo lweDimensional

Enye yezona mpawu zibalulekileyo ze-FR4 sheet substrate kukuzinza kwayo okungaqhelekanga. Izinto ezibonakalayo zibonisa i-coefficients ephantsi yokwandiswa kwe-thermal, ngokuqhelekileyo malunga ne-14-17 ppm / ° C kwiindlela ze-X kunye ne-Y kunye ne-50-70 ppm / ° C kwicala le-Z. Olu uzinzo luqinisekisa ukuba i-substrate igcina imilo kunye nobukhulu bayo kuluhlu olubanzi lweqondo lokushisa, okubalulekileyo ekugcineni ukubekwa kwecandelo kunye nokuthintela i-warpage kwiibhodi zeesekethe eziprintiweyo ezininzi (iiPCBs).

Ubuchule kunye nokusebenza

I-FR4 sheet substrate ithathwa kakhulu ngokusebenza kwayo okugqwesileyo, iyenza ilungele ukugrumba, ukusika, kunye nokubumba ngexesha lokwenziwa kwePCB. Ubuninzi bayo obuhambelanayo kunye nokwakheka okufanayo kuvumela umatshini ochanekileyo, ovumela ukudalwa koyilo oluntsonkothileyo kunye nokunyamezela okuqinileyo. Ngaphezu koko, iipropathi zokuncamathela eziqinileyo ze-FR4 ziqinisekisa ukudibanisa okukhuselekileyo kunye neefoyile zobhedu kunye naphakathi kweengqimba kwii-PCB ezinomaleko amaninzi, ziphucula ukuthembeka okupheleleyo kunye nokuqina kwemveliso yokugqibela, nakwiinkqubo ezintsonkothileyo, ezixineneyo eziphezulu.

Iipropati zoThermo kunye nokusiNgqongileyo kwe-FR4 Substrate

UkuBuyiswa komlilo

Njengoko igama layo libonisa, i-FR4 sheet substrate yenzelwe kunye nezakhiwo ezifakwe ngaphakathi kwi-flame-retardant, iqinisekisa ukuba ihlangabezana nemigangatho ye-UL94 V-0. Oku kuthetha ukuba xa kwenzeka ukucima, izinto eziphathekayo ziya kuzicima ngaphakathi kwemizuzwana ye-10 kwaye aziyi kuvelisa nayiphi na i-drips evuthayo, ukunciphisa izingozi zomlilo. Olu phawu lubalulekileyo lokhuseleko lwenza i-FR4 ilungele ukusetyenziswa kwizicelo apho ukuxhathisa umlilo kubaluleke kakhulu, njenge-electronics yabathengi, iinkqubo zemoto, izixhobo zonyango, kunye nezixhobo ze-aerospace, ukubonelela ukukhuselwa okuphuculweyo kwiindawo ezibuthathaka.

I-Thermal Conductivity kunye ne-Heat Resistance

Ngelixa i-FR4 sheet substrate ingenzelwanga ngokukodwa ukutshatyalaliswa kobushushu, inika ukuhanjiswa kwe-thermal ephakathi, ngokuqhelekileyo malunga ne-0.25-0.3 W / mK. Oku kunceda ekusasazeni ubushushu kuyo yonke i-PCB, ukuthintela ukufudumeza kwendawo. Ukusetyenziswa kwamandla aphezulu, nangona kunjalo, izisombululo ezongezelelweyo zolawulo lwe-thermal zingafuneka. Ukongezelela, iphepha le-FR4 libonisa ukumelana nokushisa okulungileyo, kunye neqondo lokushisa lokutshintsha kweglasi (Tg) phakathi kwe-130 ° C kunye ne-180 ° C, kuxhomekeke ekuqulunqweni, ukuqinisekisa ukuzinza kunye nokuthembeka nangaphantsi kwamaqondo okushisa aphakamileyo kwiindawo ezahlukeneyo ze-elektroniki.

Ukufunxa ukufuma kunye nokuNxhathisa kwiMichiza

I-FR4 sheet substrate imelana kakhulu nokufuma, ifunxa ngaphantsi kwe-0.5% ngobunzima phantsi kweemeko eziqhelekileyo zomoya. Olu kufunxa ukufuma okuncinci luqinisekisa ukuba izinto zigcina ukuthembeka kwazo kombane kunye noomatshini, nokuba zikwiindawo ezinamazinga okufuma atshintshatshintshayo. Ngaphezu koko, i-FR4 ibonisa ukuxhathisa okukhulu kwiikhemikhali ezahlukeneyo, izinyibilikisi, kunye neeoyile, nto leyo eyomeleza ukuqina kwayo kwaye iyenze ifaneleke ukusetyenziswa kwiindawo zokusebenza ezinzima, ezifana nezoshishino, iimoto, kunye nezonyango apho ukuthembeka kwexesha elide kubalulekile.

isiphelo

Iipropati ze-FR4 sheet substrate ziyenza ibe yimathiriyeli ekhethekileyo yoluhlu olubanzi lwezicelo ze-elektroniki. Indibaniselwano yayo elungeleleneyo yokugqunywa kombane, amandla omatshini, uzinzo lobushushu, kunye nokumelana nokusingqongileyo kuseke i-FR4 njengomgangatho woshishino wokwenziwa kwePCB. Njengoko itekhnoloji ihambela phambili, ukuqonda ezi propati kuya kubaluleke ngakumbi kwiinjineli kunye nabavelisi abafuna ukwenza ngcono uyilo kunye neemveliso zabo zombane.

Qhagamshelana nathi

Ukuze ufumane ulwazi oluthe kratya malunga ne -FR4 sheet substrate kunye noluhlu lwethu lwee-insulating sheets, nceda ungathandabuzi ukuqhagamshelana nathi. Iqela lethu leengcali likulungele ukukunceda ekukhetheni izixhobo ezifanelekileyo kwizicelo zakho ezithile. Nxibelelana nathi namhlanje ku-info@jhd-material.com ukuze ufunde okungakumbi malunga nezisombululo zethu ze-FR4 sheet substrate kunye nendlela ezinokunceda ngayo iiprojekthi zakho.

Ucaphulo

1. Johnson, RW, & Tong, J. (2019). Ukuqhubela phambili kwi-FR4 Substrate Technology ye-High-Speed ​​Digital Applications. Ijenali yeMathiriyeli ye-Electronic, 48 (7), 4215-4229.

2. Zhang, L., & Chen, X. (2020). Izicwangciso-qhinga zoLawulo lwe-Thermal kwiiBhodi zeSekethe eziprintiweyo ezisekelwe kwi-FR4. IiNtengiselwano ze-IEEE kwiZiqendu, ukuPakisha kunye neTekhnoloji yoMveliso, i-10 (3), i-456-468.

3 .Smith, AB, & Brown, CD (2018). Uhlalutyo oluthelekisayo lwe-FR4 kunye ne-High-Frequency Laminates kwi-RF Applications. I-Microwave Journal, i-61 (5), i-84-92.

4. Lee, YH, & Park, SJ (2021). Uzinzo lweNdawo yeFR4 Substrates phantsi kweeMeko eziBabekileyo. Ijenali yeSayensi yeMpahla: Izixhobo kwi-Electronics, i-32 (9), i-11876-11889.

5. Wang, F., & Liu, G. (2017). IiPropati zoomatshini kunye neendlela zokungaphumeleli ze-FR4 Laminates: uPhononongo oluBanzi. Izakhiwo ezidibeneyo, i-182, i-580-596.

6. Nguyen, TH, & Kim, JS (2022). Uphuhliso lwakutsha nje kwi-FR4 Substrate Formulations yokuSebenza okuPhuculweyo koMbane. IEEE iMagazini yokuNgeniswa koMbane, i-38 (2), i-7-15.