Ukwandiswa kobushushu kwi-MOSFET kufakwe kwii-substrates ezahlukeneyo ze-FR4 ngomlinganiselo wobushushu odlulayo.

Kwicandelo lokwenziwa kwezixhobo ze-elektroniki, ulawulo lobushushu ludlala indima ebalulekileyo ekuqinisekiseni ukusebenza kakuhle kunye nobude bexesha. Oku kuyinyani ngakumbi kwi-Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs), ezixhaphakileyo kwii-elektroniki zanamhlanje. Ukuqonda nokuphucula ukudluliselwa kobushushu kwezi zinto kubalulekile kubavelisi kunye neenjineli ngokufanayo. Kolu phononongo lubanzi, siza kujonga kwiinkcukacha zokuphucula ukudluliselwa kobushushu kwi-MOSFET ezifakwe kwii-substrates ezahlukeneyo ze-FR4 , sisebenzisa iindlela zokulinganisa ubushushu obufutshane.

Ukuqonda iimpawu ze-MOSFET zoThermal

Ulwakhiwo lwe-MOSFET kunye nokuVeliswa kobushushu

Ii-MOSFET zizixhobo zesemiconductor ezilawula ukuhamba kombane kwiisekethe zombane. Isakhiwo sabo siquka iitheminali ezintathu eziphambili: umthombo, umsele kunye nesango. Ngethuba lokusebenza, ii-MOSFETs zivelisa ubushushu ngenxa yokutshatyalaliswa kwamandla, ngokukodwa kwingingqi yomjelo phakathi komthombo kunye ne-drain. Esi sizukulwana sobushushu sinokuchaphazela kakhulu ukusebenza kwesixhobo kunye nokuthembeka ukuba asilawulwa kakuhle.

Ukubaluleka koLawulo lweThermal kwiiMOSFET

Ulawulo olusebenzayo lwe-thermal lubalulekile kumsebenzi we-MOSFET. Ubushushu obugqithisileyo bunokukhokelela kwimiba eyahlukahlukeneyo, kuquka ukuncipha kokusebenza kakuhle, ukunciphisa ixesha lokuphila, kunye nokusilela okuyintlekele. Ngokusebenzisa iindlela ezifanelekileyo zokuphelisa ubushushu, abavelisi banokuqinisekisa ukusebenza kwe-MOSFET ngokufanelekileyo kwaye bandise ubomi bokusebenza kwesixhobo.

Indima yeeSubstrates ekuTyelweni koBubushushu

I-substrate apho i-MOSFET ifakwe khona idlala indima ebalulekileyo ekuchitheni ubushushu. I-FR4 , into eqhelekileyo kwishishini le-elektroniki, yaziwa ngeempawu zayo zokuthintela ubushushu. Nangona kunjalo, ukuhanjiswa kwayo kobushushu kuphantsi xa kuthelekiswa nezinye izinto. Ukuqonda indlela ii-substrate ezahlukeneyo ze-FR4 ezichaphazela ngayo ukudluliselwa kobushushu kubalulekile ekwenzeni ngcono ukusebenza kobushushu be-MOSFET.

IiTeknikhi zoMlinganiso oThutyanayo weThermal

Imigaqo yoMlinganiso we-Thermal Transient

Umlinganiselo wobushushu odlulayo bubuchule obunamandla bokuhlalutya ukuhanjiswa kobushushu kumalungu e-elektroniki. Kubandakanya ukufaka i-pulse yamandla eyaziwayo kwisixhobo kunye nokulinganisa isiphumo sokutshintsha kobushushu ekuhambeni kwexesha. Le ndlela ibonelela ngezimvo ezixabisekileyo kwindlela yokuziphatha eshushu yee-MOSFETs kunye nee-substrates zazo ezinyukayo.

Izixhobo kunye nokuSeta iMilinganiselo ye-Thermal Transient

Ukuqhuba imilinganiselo ye-thermal yexeshana kufuna izixhobo ezikhethekileyo, kubandakanywa izinzwa zokushisa ezichanekileyo, izixhobo zombane, kunye neenkqubo zokufumana idatha. I-MOSFET iqhele ukuxhonywa kwi-FR4 substrate phantsi kovavanyo kwaye iqhagamshelwe kwisixhobo sokulinganisa. Ukuseta ngononophelo kunye nokulinganisa kubalulekile ukuze ufumane iziphumo ezichanekileyo.

Uhlalutyo lwedatha kunye nokuTolika

Idatha efunyenwe kwimilinganiselo ye-thermal yexesha elifutshane inokuhlalutya ukukhupha iiparamitha ezahlukeneyo ze-thermal, ezifana nokuchasana kwe-thermal kunye ne-capacitance. Ezi parameters zibonelela ngomlinganiselo wobungakanani bobuchule bokudlulisa ubushushu be-MOSFET kunye nendibaniselwano ye-substrate. Izixhobo zesoftware eziphucukileyo zidla ngokuqeshwa ukucubungula nokutolika idatha yomlinganiselo ngokufanelekileyo.

Ukuthelekisa ukuTshintshela koBubushushu kwiiSubstrates ezahlukeneyo zeFR4

Ukwahluka kwi-FR4 Substrate Composition

Ii-substrates ze-FR4 zingahluka ngokwakhiwa, ubukhulu, kunye neenkqubo zokuvelisa. Ezi nguqu zinokuchaphazela kakhulu iimpawu zazo zobushushu. Ezinye ii-substrates ze-FR4 zinokubandakanya izongezo okanye izizalisi ukuphucula ukuhanjiswa kobushushu, ngelixa ezinye zinokugxila ekwenzeni ngcono ukusebenza kombane. Ukuqonda ezi mahluko kubalulekile xa ukhetha i-substrate efanelekileyo kwizicelo ze-MOSFET.

Impembelelo yokutyeba kweSubstrate ekuTyelweni koBubushushu

Ubunzima be-FR4 substrate budlala indima ebalulekileyo ekugqithiseni ubushushu. Iisubstrates ezityebileyo ngokubanzi zibonelela ngozinzo olungcono loomatshini kodwa zinokuthintela ukulahla ubushushu ngenxa yokwanda kokuxhathisa ubushushu. Ngokuchaseneyo, ii-substrates ezibhityileyo zinokuququzelela ukuhanjiswa kobushushu okusebenzayo kodwa zinokubeka esichengeni isidima solwakhiwo. Ukufumana ulungelelwaniso olufanelekileyo phakathi kwezi zinto kubalulekile ekwandiseni ukusebenza kwe-MOSFET.

UkuGqiba komphezulu kunye nempembelelo yayo kwiNtsebenzo ye-Thermal

Ukugqitywa komphezulu we-FR4 substrates kunokuchaphazela kakhulu ukuhanjiswa kobushushu. Unyango olwahlukileyo lomphezulu, olufana nokugqunywa kobhedu okanye iingubo ezikhethekileyo, lunokutshintsha i-thermal interface phakathi kwe-MOSFET kunye ne-substrate. Ukuphucula olu jongano kubalulekile ekwandiseni ukuchithwa kobushushu ngokubanzi kunye nokuphucula ukuthembeka kwesixhobo.

Izicwangciso-qhinga zokuPhucula uThutho loBubushushu kwiiNkqubo zeMOSFET-FR4

I-Thermal Vias kunye nokuphunyezwa kwazo

Enye indlela esebenzayo yokuphucula ukuhanjiswa kobushushu kwiinkqubo zeMOSFET-FR4 kukusetyenziswa kwe-thermal vias. Ezi zincinci, zifakwe kwimingxuma ebonelela ngendlela ephantsi yokumelana nobushushu ukusuka kwi-MOSFET ukuya kwelinye icala le-substrate. Ilungiselelwe ngokufanelekileyo kwaye iphunyezwe nge-thermal vias inokunciphisa kakhulu ukuxhathisa kwe-thermal yenkqubo.

Izinto eziPhambili ze-Substrate kunye ne-Composites

Ngelixa i-FR4 ihlala ilukhetho oludumileyo ngenxa yeendleko zayo kunye neempawu zombane, izinto ezikumgangatho ophantsi we-substrate kunye ne-composites zivela njengezinye iindlela zokusebenza eziphezulu zokusebenza. Ezi zixhobo zihlala zibandakanya i-ceramics okanye i-metal-matrix composites ukuphumeza i-conductivity ephezulu ye-thermal ngelixa ugcina iimpawu zombane ezinqwenelekayo.

Ukuphucula uYilo lwePakeji yeMOSFET

Uyilo lwephakheji ye-MOSFET ngokwayo inokuchaphazela kakhulu ukuhanjiswa kobushushu. Abavelisi baqhubeka bephuhlisa uyilo lwepakethe emitsha eyenza ukusebenza kakuhle kwe-thermal. Iimpawu ezinje ngeepadi eziveziweyo, izixhobo eziphuculweyo zokuncamathisela, kunye noyilo lwesakhelo esikhokelayo sinokuphucula ukulahla ubushushu kunye nokusebenza kakuhle kwesixhobo.

Iingqwalasela eziSebenzayo zokuSebenzisa iziPhumo zokuThuthukiswa koBubushushu

Uhlalutyo lweendleko zeNzuzo yeZisombululo ezahlukeneyo

Xa kucingwa ngokuphuculwa kokudluliselwa kobushushu kwiinkqubo zeMOSFET- FR4 , kubalulekile ukuvavanya ukusebenza kakuhle kwezisombululo ezahlukeneyo. Nangona ezinye izixhobo okanye iindlela eziphambili zinokubonelela ngokusebenza kakuhle kobushushu, zinokuba nemiphumo ebalulekileyo yeendleko. Ukwenza uhlalutyo olupheleleyo lweendleko kunye neenzuzo kunceda ekwenzeni izigqibo ezinolwazi ezilungelelanisa ukuphuculwa kokusebenza kunye nokwenzeka kwezoqoqosho.

Imingeni yokuVelisa kunye nezisombululo

Ukusebenzisa iindlela ezithile zokwandisa ubushushu kunokuzisa imingeni kwimveliso. Umzekelo, ukwenza i-aspect-retio thermal vias okanye ukusebenza ngezinto ezidityanisiweyo eziphambili kunokufuna izixhobo ezikhethekileyo okanye iinkqubo. Ukujongana nale mingeni kuhlala kubandakanya intsebenziswano phakathi kweenjineli zoyilo kunye namaqela avelisayo ukuphuhlisa izisombululo ezinokwenzeka nezinokwenzeka.

Iingqwalasela zeNtembeko yexesha elide

Ngelixa ukuphucula ukuhanjiswa kobushushu kubalulekile ekusebenzeni kwangoko, ukuthembeka kwexesha elide nako kufuneka kuqwalaselwe. Ezinye iindlela zokuphucula zinokuzisa iindlela ezintsha zokusilela okanye zichaphazele ubomi bubonke besixhobo. Uvavanyo olungqongqo kunye nohlalutyo oluthembekileyo luyimfuneko ukuze kuqinisekiswe ukuba ukuphuculwa kokudluliselwa kobushushu akuthinteli ukuqina kwexesha elide leenkqubo ze-MOSFET-FR4.

isiphelo

Ukuphucula ukudluliselwa kobushushu kwiMOSFETs ezifakwe kwi -FR4 substrates ngumceli mngeni oneenkalo ezininzi ofuna ukuqonda okunzulu nge-thermal dynamics, iipropati zezinto, kunye neenkqubo zokuvelisa. Ngokusebenzisa iindlela zokulinganisa ze-thermal transient kunye nokusebenzisa izisombululo ezintsha ezifana noyilo lwe-substrate olulungisiweyo, ii-thermal vias, kunye nokupakisha okuphucukileyo, abavelisi banokuphucula kakhulu ukusebenza kobushushu beenkqubo zeMOSFET-FR4. Njengoko imfuno yezixhobo ze-elektroniki ezisebenzayo nezithembekileyo iqhubeka nokukhula, uphando oluqhubekayo kunye nophuhliso kweli candelo ngokungathandabuzekiyo luya kukhokelela ekuqhubekeni phambili kwizicwangciso zokuphucula ukudluliselwa kobushushu.

Qhagamshelana nathi

Ukuze ufumane ulwazi oluthe kratya malunga neemveliso zethu zephepha lokukhusela kunye nendlela ezinokunceda ngayo usetyenziso lwakho lwe-MOSFET, nceda ungathandabuzi ukuqhagamshelana nathi ku-info@jhd-material.com . Iqela lethu leengcali likulungele ukukunceda ekufumaneni isisombululo solawulo lobushushu esifanelekileyo kwiimfuno zakho ezithile.

Ucaphulo

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2. Chen, S., et al. (2019). "Uhlalutyo lwe-Thermal Transient Transient of Power MOSFETs: iiNgcaciso eziNtsha kunye neendlela eziphuculweyo zokulinganisa." Ukuthembeka kweMicroelectronics, i-94, i-66-74.

3. Wang, J., et al. (2018). "Uphononongo oluthelekisayo lwe-FR4 Substrates kwi-High-Power-Power MOSFET Application: i-Thermal and Electrical Performance." Ijenali yeMathiriyeli ye-Electronic, 47(10), 5889-5898.

4. Lee, H., et al. (2021). "Izicwangciso-qhinga eziPhezulu zoLawulo lwe-Thermal kwii-MOSFET eziSebenza ngokuPhezulu: Ukusuka kwi-Substrate Selection ukuya kwi-Package Design." IEEE Ijenali yeMixholo ekhulayo kunye neKhethiweyo kwi-Electronics yaMandla, i-9 (1), i-768-781.

5. Russo, M., et al. (2017). "Ukulungiswa kwe-Thermal Vias kwi-FR4 PCB yokuphucula ukutshatyalaliswa kobushushu kwizicelo ze-MOSFET zaMandla." Ubunjineli be-Thermal obusetyenzisiweyo, i-115, i-619-629.

6. UKim, Y., et al. (2022). "Izincedisi ze-Substrate yesiZukulwana esilandelayo soMbane woMbane woMbane: Ukulinganisa ukuSebenza kwe-Thermal kunye nokuSebenza kweNdleko." I-Advanced Materials Technologies, 7(3), 2100987.